[Conference] InterPACK 2022 – Presentation Garden Grove, USA 26th October 2022 <Oral presentation at International Electronic Packaging Technical Conference and Exhibition (InterPACK) 2022> Authors: Yunseo Kim, Daeyoung Kong, Jungbae Lee, Bongho Jang, Hyuk-Jun Kwon, Jung Bin In, and Hyoungsoon Lee Presenter: Yunseo Kim (Chung-Ang Univ.) Title: “Porous Diamond Surface for Enhanced Two-Phase Heat Transfer (Paper number: 97370),” Session: ’06-04 Thermal Management Applications Section 1′ Date & Time: October 26, Wednesday / 10:15 AM – 11:45 AM