[Conference] InterPACK 2022 – Presentation

[Conference] InterPACK 2022 – Presentation

Garden Grove, USA
26th October 2022

<Oral presentation at International Electronic Packaging Technical Conference and Exhibition (InterPACK) 2022>

Authors: Yunseo Kim, Daeyoung Kong, Jungbae Lee, Bongho Jang, Hyuk-Jun Kwon, Jung Bin In, and Hyoungsoon Lee

Presenter: Yunseo Kim (Chung-Ang Univ.)

Title: “Porous Diamond Surface for Enhanced Two-Phase Heat Transfer (Paper number97370),” 

Session: ’06-04 Thermal Management Applications Section 1′

Date & Time: October 26, Wednesday / 10:15 AM – 11:45 AM