[Published Paper] Applied Thermal Engineering 12th January 2024 <Published Paper – Applied Thermal Engineering> Authors: Kiwan Kim, Daeyoung Kong, Yunseo Kim, Bongho Jang, Jungwan Cho, Hyuk-Jun Kwon, and Hyoungsoon Lee** Title: “Enhanced Boiling Heat Transfer via Microporous Copper Surface Integration in a Manifold Microgap” Journal: Applied Thermal Engineering (IF: 6.4, 93.8%, JCR 2022Y) DOI: 10.1016/j.applthermaleng.2023.122325 Volume (Year): 241 (2024) Pages: 122325 From Media
